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Direct liquid cooling, the main target of this article, may additionally be termed directliquid immersion cooling, since there are no physical walls separating themicroelectronic chips and the floor of the substrate from the liquid type of cooling affords the opportunity to remove heat straight from thechip(s) with no intervening thermal conduction resistance, aside from thatbetween the gadget heat sources and the chip surfaces involved with theliquid.
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Water is an example of a liquid which hasvery desirable heat switch traits, but which is mostly unsuitablefor direct immersion cooling on account of its chemical characteristics.Fluorocarbon liquids (e.g. FC-seventy two, FC-86, FC-seventy seven, and many others.) are usually consideredto be the most appropriate liquids for direct immersion cooling, regardless of theirpoorer thermo-physical properties.